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Semtek FOUP/FOSB Cleaner SC-106

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機能・特性
  • Equipped with high-pressure nozzles and software-controlled operation, it enables directional cleaning by adjusting the angle and orientation of the nozzles.
  • Reduce process contamination.
  • Save 30% floor space.
  • Effectively removing Particle / AMC / residual photoresist and adhesive contaminants.
製品情報
  • MANUFACTURER
    Semtek
  • MANUFACTURING PROCESS
    WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • DETAILS
    Fully utilizing DIW throughout the process, it is capable of cleaning carriers such as FOUP/FOSB, Magazine, Boat/Jig, Frame/Tray, Cassette, Frame CST, and Tray CST.
営業担当者

お気軽にお問い合わせ・ご相談ください

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Larry Chuang
    • Tel : 07-3663308
    • Mail : Larry_Chuang@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw